The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2011

Filed:

Jun. 03, 2009
Applicants:

Josef Boeck, Munich, DE;

Karl-heinz Allers, Haar, DE;

Klaus Goller, Regensburg, DE;

Rudolf Lachner, Ingolstadt, DE;

Wolfgang Liebl, Bad Abbach, DE;

Inventors:

Josef Boeck, Munich, DE;

Karl-Heinz Allers, Haar, DE;

Klaus Goller, Regensburg, DE;

Rudolf Lachner, Ingolstadt, DE;

Wolfgang Liebl, Bad Abbach, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 20/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

One or more embodiments relate to a semiconductor chip including a capacitor arrangement, the capacitor arrangement comprising: a first capacitor; and a second capacitor stacked above the first capacitor, the first capacitor and the second capacitor coupled in series between a first metallization level and a second metallization level adjacent the first metallization level.


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