The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Jun. 29, 2007
Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom
Atsushi Sato, Ohtake, JP;
Hideyuki Takai, Ohtake, JP;
Hisashi Maeshima, Ohtake, JP;
Kyuhei Kitao, Ohtake, JP;
Atsushi Sato, Ohtake, JP;
Hideyuki Takai, Ohtake, JP;
Hisashi Maeshima, Ohtake, JP;
Kyuhei Kitao, Ohtake, JP;
Daicel Chemical Industries, Ltd., Osaka-Shi, JP;
Abstract
Disclosed is an alicyclic diepoxy compound which gives a cured article suffering from no deterioration in properties even when used in hot and humid surroundings or used under such conditions as to give a strong acid, which is highly reactive upon curing, and which gives a cured article superior typically in thermal stability. Specifically, the alicyclic diepoxy compound includes a 3,4,3',4′-diepoxybicyclohexyl compound represented by following Formula (1): wherein R1 to R18 each represent a hydrogen atom, a halogen atom, a hydrocarbon group which may have an oxygen atom or a halogen atom, or a substituted or unsubstituted alkoxy group, in which the alicyclic diepoxy compound contains isomers of the 3,4,3′,4′-diepoxybicyclohexyl compound in a content of less than 20% based on the total of the 3,4,3′,4′-diepoxybicyclohexyl compound and the isomers thereof in terms of peak area ratio as determined by gas chromatography.