The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Jul. 01, 2004
Adrian Boyle, Rathangan, IE;
David Gillen, Clontarf, IE;
Maria Farsari, Heraklion, GR;
Electro Scientific Industries, Inc., Portland, OR (US);
Abstract
A die bonding method and apparatus by which a wafer substrateadhered to a carrier tapeby an adhesive layeris laser machined through the wafer substrate and through the adhesive layer at most to scribe the carrier tape to form a singulated diewith an attached singulated adhesive layer, without substantial delamination of the adhesive layerand carrier tapeor substantial production of burrs from the adhesive layer. The carrier tapeis cured, preferably by ultraviolet light, to release the adhesive layer from the carrier tape. The singulated die is picked and placed on a die pad and the adhesive layeris cured, preferably by heat, to adhere the die to the die pad.