The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Apr. 28, 2006
Kenichi Morikawa, Yokkaichi, JP;
Katsutoshi Ohno, Yokkaichi, JP;
Kenichi Morikawa, Yokkaichi, JP;
Katsutoshi Ohno, Yokkaichi, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
To provide an acid-modified polypropylene resin which can be used for an adhesive capable of bonding a polyolefin type resin and a polar resin with sufficient force, its production process and a resin composition using it. An acid-modified polypropylene resin, which is obtained by grafting an organic acid component to a polypropylene resin, wherein the polypropylene resin is an isotactic polypropylene resin, the grafted amount X (wt %) of the organic acid component in the acid-modified polypropylene resin is within a range of from 1.0 wt % to 20.0 wt %, and the melt flow rate Y (g/10 min) of the acid-modified polypropylene resin satisfies the expression: Y≦18.5 exp(0.82X), a process for producing such an acid-modified polypropylene resin, a resin composition using it and a laminate.