The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Jan. 22, 2007
Seiichi Matsuoka, Tokyo, JP;
Toshio Nakane, Fuji, JP;
Seiichi Matsuoka, Tokyo, JP;
Toshio Nakane, Fuji, JP;
Fuji Jukogyo Kabushiki Kaisha, Tokyo, JP;
Polyplastics Co., Ltd, Tokyo, JP;
Abstract
A resin composition formed by blending 10 to 25 weight parts of the epoxy modified polystyrene resin (B) to 100 weight parts of the liquid crystal polyester and/or the liquid crystal polyester amide (A) and by melt-kneading the two materials, wherein the resin composition having a melt viscosity of 60 to 4000 Pa·s at a shear rate of 1000/second at a temperature which is 20° C. higher than the melting point and having a melt tension of 20 mN or more at a take-over speed of 15 m/minute, is melt within a temperature range of a melting point to the melting point +40° C., a parison P is formed by extruding it with an extrusion speed equal to or higher than 0.3 kg/minute and lower than 5 kg/minute, a pair of moldings placed so as to sandwich the parison P are closed at a predetermined mold closing pressure, and air is blown into the parison P.