The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Feb. 26, 2004
Masashi Gotoh, Tokyo, JP;
Kaoru Kawasaki, Tokyo, JP;
Hiroshi Yamamoto, Tokyo, JP;
Mutsuko Nakano, Tokyo, JP;
Hajime Kuwajima, Tokyo, JP;
Masashi Gotoh, Tokyo, JP;
Kaoru Kawasaki, Tokyo, JP;
Hiroshi Yamamoto, Tokyo, JP;
Mutsuko Nakano, Tokyo, JP;
Hajime Kuwajima, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.