The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Nov. 19, 2008
Dong-qing He, Shenzhen, CN;
Ming Wang, Shenzhen, CN;
Yun-li Zhu, Shenzhen, CN;
Wen-chin Lee, Taoyuan, TW;
Dong-Qing He, Shenzhen, CN;
Ming Wang, Shenzhen, CN;
Yun-Li Zhu, Shenzhen, CN;
Wen-Chin Lee, Taoyuan, TW;
FuKui Precision Component (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Advanced Technology Inc., Tayuan, Taoyuan, TW;
Abstract
A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.