The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Feb. 13, 2009
Mitsuaki Nakata, Chiyoda-ku, JP;
Tomonori Abe, Chiyoda-ku, JP;
Kosei Tsuji, Chiyoda-ku, JP;
Yuhei Awano, Chiyoda-ku, JP;
Kazuhiko Yamashita, Chiyoda-ku, JP;
Hideo Iinuma, Chiyoda-ku, JP;
Iwao Katsuno, Chiyoda-ku, JP;
Takayuki Inuzuka, Chiyoda-ku, JP;
Akihiro Fujita, Chiyoda-ku, JP;
Mitsuaki Nakata, Chiyoda-ku, JP;
Tomonori Abe, Chiyoda-ku, JP;
Kosei Tsuji, Chiyoda-ku, JP;
Yuhei Awano, Chiyoda-ku, JP;
Kazuhiko Yamashita, Chiyoda-ku, JP;
Hideo Iinuma, Chiyoda-ku, JP;
Iwao Katsuno, Chiyoda-ku, JP;
Takayuki Inuzuka, Chiyoda-ku, JP;
Akihiro Fujita, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.