The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Oct. 24, 2007
Applicant:
Naoyoshi Kawahara, Kanagawa, JP;
Inventor:
Naoyoshi Kawahara, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 29/73 (2006.01);
U.S. Cl.
CPC ...
Abstract
When a metal cap film is provided on an electric fuse, the break-ability of the electric fuse is reduced. A semiconductor deviceincludes interconnects, an electric fuseand metal cap films. Both of the interconnectsand the electric fuseare composed of Cu. The interconnectsand the electric fuseare provided in the same layer in the interconnect layer. The metal cap filmsare provided only on the interconnectsand not provided on the electric fuse
Kawahara, Naoyoshi. (2011). Semiconductor device and method for manufacturing same (U.S. Patent No. 7986025). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7986025
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile