The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Mar. 12, 2008
Ryoichi Kajiwara, Hitachi, JP;
Masahiro Koizumi, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Kazuya Takahashi, Hitachinaka, JP;
Munehisa Kishimoto, Kamakura, JP;
Shigeru Ishii, Tomiya-machi, JP;
Toshinori Hirashima, Takasaki, JP;
Yasushi Takahashi, Nishiyokote-machi, JP;
Toshiyuki Hata, Maebashi, JP;
Hiroshi Sato, Takasaki, JP;
Keiichi Ookawa, Takasaki, JP;
Ryoichi Kajiwara, Hitachi, JP;
Masahiro Koizumi, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Kazuya Takahashi, Hitachinaka, JP;
Munehisa Kishimoto, Kamakura, JP;
Shigeru Ishii, Tomiya-machi, JP;
Toshinori Hirashima, Takasaki, JP;
Yasushi Takahashi, Nishiyokote-machi, JP;
Toshiyuki Hata, Maebashi, JP;
Hiroshi Sato, Takasaki, JP;
Keiichi Ookawa, Takasaki, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Hitachi Tohbu Semiconductor, Ltd., Gunma, JP;
Abstract
A semiconductor device features a semiconductor substrate with a MOSFET, an electrode for main current of the MOSFET disposed on a first major surface of the substrate, an electrode for control of the MOSFET disposed on the first major surface, a rear plane electrode of the MOSFET disposed on a second, opposing surface of the substrate, and an external connection terminal electrically connected to the rear plane electrode, the external electrode contains a first part, a second part and a third part, the first part is positioned over the rear plane electrode, the third part is positioned below the second major surface and the third part is connected via the second part to the first part.