The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2011

Filed:

Jan. 07, 2008
Applicants:

Satoshi Yagi, Makinohara, JP;

Shigeharu Suzuki, Makinohara, JP;

Tetsuro Ide, Makinohara, JP;

Hideto Kumakura, Makinohara, JP;

Kenji Suzuki, Makinohara, JP;

Inventors:

Satoshi Yagi, Makinohara, JP;

Shigeharu Suzuki, Makinohara, JP;

Tetsuro Ide, Makinohara, JP;

Hideto Kumakura, Makinohara, JP;

Kenji Suzuki, Makinohara, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A terminal crimping structure includes a terminal crimped to a copper alloy wire. The terminal has a crimping piece portion crimped to the copper alloy core wire portion. A rate of compression of the copper alloy core wire portion, of a particular diameter, by the crimping piece portion is determined from a relative relation between a parameter varying according to the ratio of (the cross-sectional area of the copper alloy core wire portion at a crimped portion)/(the cross-sectional area of the copper alloy core wire portion before crimping) and a parameter varying according to the ratio of (a cross-sectional area of an annealed copper core wire portion at a crimped portion)/the cross-sectional area of the annealed copper core wire portion before crimping) which is the rate of compression of the annealed copper core wire portion by the crimping piece portion.


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