The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Jun. 15, 2007
Viet Nguyen Hoang, Leuven, BE;
Phillip Christie, Leuven, BE;
Julien M. M. Michelon, Le Boulay, FR;
NXP B.V., Eindhoven, NL;
Abstract
The invention relates to a semiconductor device manufactured in a process technology, the semiconductor device having at least one wire located in an interconnect layer of said semiconductor device, the at least one wire having a wire width (W) and a wire thickness (T), the wire width (W) being equal to a minimum feature size of the interconnect layer as defined by said process technology, wherein the minimum feature size is smaller than or equal to 0.32 μm, wherein the aspect ratio (AR) of the at least one wire is smaller than 1.5, the aspect ratio (AR) being defined as the wire thickness (T) divided by the wire width (W). The invention further discloses a method of manufacturing such a semiconductor device.