The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2011

Filed:

Nov. 05, 2004
Applicants:

Takeo Hisada, Minami-ku, JP;

Yasushi Kaneta, Minami-ku, JP;

Shinobu Takagi, Minami-ku, JP;

Naoki Fuse, Minami-ku, JP;

Inventors:

Takeo Hisada, Minami-ku, JP;

Yasushi Kaneta, Minami-ku, JP;

Shinobu Takagi, Minami-ku, JP;

Naoki Fuse, Minami-ku, JP;

Assignee:

Daido Steel Co., Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/18 (2006.01); C25D 3/48 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a corrosion resistant conductive part, which is made by forming a thin plated gold layer of thickness 100 nm or less on a stainless steel sheet, and for which high corrosion resistance is guaranteed even with a very thin gold layer. The part is characterized in that the maximum value 'v' of atomic concentration of gold given by Auger analysis is at least 98% of the total atomic concentrations of all the elements, which is deemed to be 100%, in the thin gold layer ranging from the surface to the interface of the gold layer and the metal substrate, at which the descending curve of gold crosses the ascending curve of the most predominant component of the substrate metal.


Find Patent Forward Citations

Loading…