The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Sep. 09, 2009
Takami Moteki, Tokyo, JP;
Yuuji Suzuki, Tokyo, JP;
Kazuhiro Hoshino, Tokyo, JP;
Kensaku Shinozaki, Tokyo, JP;
Akira Matsuda, Tokyo, JP;
Takami Moteki, Tokyo, JP;
Yuuji Suzuki, Tokyo, JP;
Kazuhiro Hoshino, Tokyo, JP;
Kensaku Shinozaki, Tokyo, JP;
Akira Matsuda, Tokyo, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.