The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2011
Filed:
Jan. 29, 2007
Ryuji Tanaka, Numazu, JP;
Toshiyuki Takagi, Susono, JP;
Toshihisa Kamano, Numazu, JP;
Isao Matsuzuki, Numazu, JP;
Ryuji Tanaka, Numazu, JP;
Toshiyuki Takagi, Susono, JP;
Toshihisa Kamano, Numazu, JP;
Isao Matsuzuki, Numazu, JP;
Toshiba Kikai Kabushiki Kaisha, Tokyo-To, JP;
Abstract
In the initial stage of die-opening operation when an upper coremoves upward together with an upper die plate, an upper cavity dieis biased downwardly by an elastic memberso as to press the lower surface of the upper cavity dieagainst the upper surface of a lower cavity dieand keep their contact, thereby forcing a molded glass elementto remain on a lower coreby utilizing the difference in outside diameter between the lower coreand the upper core. This makes it possible to securely release the molded glass elementfrom the upper coreand leave the molded product on the lower coreupon die opening, enabling smooth removal and automated transportation of the molded product.