The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Jun. 30, 2004
Stuart Inkpen, St. Phillips, CA;
Chris Nolan, St. John's, CA;
Darryl Pike, St. John's, CA;
Heather Rowe, St. John's, CA;
John Hall, St. John's, CA;
Dana Linfield, Portugal Cove-St. Phillips, CA;
Joshua Swamidas, St. John's, CA;
Chris Dawson, St. John's, CA;
Gerard Galway, Torbay, CA;
Shawn Walsh, St. John's, CA;
Ruth Abraham, St. John's, CA;
Stuart Inkpen, St. Phillips, CA;
Chris Nolan, St. John's, CA;
Darryl Pike, St. John's, CA;
Heather Rowe, St. John's, CA;
John Hall, St. John's, CA;
Dana Linfield, Portugal Cove-St. Phillips, CA;
Joshua Swamidas, St. John's, CA;
Chris Dawson, St. John's, CA;
Gerard Galway, Torbay, CA;
Shawn Walsh, St. John's, CA;
Ruth Abraham, St. John's, CA;
Instrumar Limited, St. Johns, Newfoundland, CA;
Abstract
A computer-based fibre production monitoring system includes at least one sensor, and a computer server in communication with the sensors. Each sensor is configured to provide data packets each being associated with a respective threadline and providing a measurement of at least one physical characteristic of a fibre as it is drawn past the sensor on the threadline and wound onto a bobbin. The computer server is configured to provide an analysis of the physical characteristics on a per-threadline basis and/or per-bobbin basis from the measurements. The sensor is configured as an electric field sensor, and includes an insulating substrate, non-contacting electrodes disposed on the substrate, and vias extending transversely through the substrate. The electrodes are interlaced with one another. One portion of the vias is coupled to one portion of the electrodes, and another portion of the vias is coupled to another portion of the electrodes.