The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Nov. 30, 2007
Applicants:
Junichi Sasaki, Tokyo, JP;
Tomoyuki Hino, Tokyo, JP;
Inventors:
Junichi Sasaki, Tokyo, JP;
Tomoyuki Hino, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A mounting structure, in which semiconductor packageand heat sinkfor dissipating heat generated from semiconductor packageare mounted on mounting board. The rear surface of semiconductor packageis bonded to the front surface of mounting boardfacing the rear surface. Heat sinkis brought into contact with the rear surface of semiconductor packagevia through-oleformed on mounting board. Semiconductor packageand heat sinkare pressed to each other by the elastic force of clip