The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
May. 25, 2009
Dai Aoki, Tokyo, JP;
Dai Aoki, Tokyo, JP;
Stanley Electric Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device can include a plurality of semiconductor elements. The characteristics of each of the semiconductor elements can be easily tested during the production of the semiconductor device or when a failure occurs after the semiconductor device is mounted on a substrate, so that the quality can be well managed and a failure can be reliably analyzed. When not mounted on the substrate, the semiconductor device can have a connection structure in which the plurality of semiconductor elements are electrically independent of each other, so that their characteristics can be tested and analyzed by independently energizing the semiconductor elements. In a semiconductor device module having the semiconductor device mounted thereon, the connection structure can include a parallel circuit of the plurality of semiconductor elements. Therefore, all the semiconductor elements can be driven by applying a voltage between a pair of solder-bonding electrode pads disposed on the semiconductor device-mounting substrate.