The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Mar. 05, 2009
Akio Suzuki, Hamamatsu, JP;
Etsuo Iizuka, Hamamatsu, JP;
Katsutoshi Nonaka, Hamamatsu, JP;
Masahiro Hayashi, Hamamatsu, JP;
Yuuya Washiyama, Hamamatsu, JP;
Akio Suzuki, Hamamatsu, JP;
Etsuo Iizuka, Hamamatsu, JP;
Katsutoshi Nonaka, Hamamatsu, JP;
Masahiro Hayashi, Hamamatsu, JP;
Yuuya Washiyama, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
In an MCP assemblyhaving one or a plurality of MCPssandwiched with an input-side electrodeand an output-side electrode, there provided at the surface facing the MCPof at least either (preferably, both) of the input-side electrodeand the output-side electrode, is a substantially annular contact face that contacts the MCP surface to fix the same, and there provided at a periphery of the contact face is a separation surface retracted in a direction to be separated from the MCP surface. Thereby, provided is an MCP assembly having a construction enabled to prevent damage to the MCP in manufacturing and handling.