The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Feb. 11, 2009
Jin-hak Choi, Suwon-si, KR;
Seoung-jae Lee, Suwon-si, KR;
Bae-kyun Kim, Seongnam-si, KR;
Eun-ju Yang, Suwon-si, KR;
Jong-yun Kim, Suwon-si, KR;
Yeo-joo Yoon, Suwon-si, KR;
Jin-Hak Choi, Suwon-si, KR;
Seoung-Jae Lee, Suwon-si, KR;
Bae-Kyun Kim, Seongnam-si, KR;
Eun-Ju Yang, Suwon-si, KR;
Jong-Yun Kim, Suwon-si, KR;
Yeo-Joo Yoon, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Samsung LED Co., Ltd., Gyunggi-Do, KR;
Abstract
Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.