The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2011

Filed:

Jul. 11, 2005
Applicants:

Donald H. Lester, Jr., Waxhaw, NC (US);

David L. Lunceford, Kingsport, TN (US);

Inventors:

Donald H. Lester, Jr., Waxhaw, NC (US);

David L. Lunceford, Kingsport, TN (US);

Assignee:

Aplix S.A., Paris, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D04H 1/58 (2006.01); D04H 1/60 (2006.01); D04H 1/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

The instant invention is a hook and loop fastener device. According to the instant invention, the hook and loop fastener device includes a loop component. The loop component includes a binder-free non-woven material having a bottom layer and a top layer. The bottom layer includes a first bicomponent fiber and a first monocomponent fiber. The first bicomponent fiber comprises the majority of the bottom layer based on total weight of the bottom layer, and the first monocomponent fiber comprises the balance thereof. The top layer includes a second bicomponent fiber, and a second monocomponent fiber. The second monocomponent fiber comprises the majority of the top layer based on total weight of the top layer, and the second bicomponent layer comprises the balance thereof. The bottom layer and the top layer may further include interfiber bonding to form the binder-free non-woven material. The non-woven material may further be island bonded via hot-roll calendering thereby forming a bonded area and a non-bonded area. Additionally, the loop component may include a backing layer bonded to the non-woven material.


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