The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Jul. 10, 2006
Nobuyasu Muto, Tokyo, JP;
Naoki Kawanabe, Tokyo, JP;
Hiroshi Ono, Tokyo, JP;
Tamaki Wada, Tokyo, JP;
Nobuyasu Muto, Tokyo, JP;
Naoki Kawanabe, Tokyo, JP;
Hiroshi Ono, Tokyo, JP;
Tamaki Wada, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substratecan be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.