The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Feb. 02, 2009
Hideki Kobayashi, Nagasaki, JP;
Masafumi Muramatsu, Kanagawa, JP;
Hideki Kobayashi, Nagasaki, JP;
Masafumi Muramatsu, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
Disclosed herein is a method of manufacturing a solid-state image pickup element, the method including the steps of forming a plurality of photoelectric conversion elements within a semiconductor substrate; forming a wiring layer via an insulating film on a surface of the semiconductor substrate in which surface the plurality of photoelectric conversion elements are formed; laminating a supporting substrate to a surface of the semiconductor substrate in which surface the wiring layer is formed via an adhesive; applying a pressure to the semiconductor substrate and the supporting substrate in a state of the semiconductor substrate and the supporting substrate being laminated to each other via the adhesive; and curing the adhesive by heating the adhesive to a curing temperature of the adhesive after releasing the applied pressure.