The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2011

Filed:

Nov. 02, 2009
Applicants:

Yoshiaki Kudo, Nagano-ken, JP;

Takashi Hakoda, Nagano-ken, JP;

Kiyoshi Nakamura, Nagano-ken, JP;

Susumu Morozumi, Nagano-ken, JP;

Inventors:

Yoshiaki Kudo, Nagano-ken, JP;

Takashi Hakoda, Nagano-ken, JP;

Kiyoshi Nakamura, Nagano-ken, JP;

Susumu Morozumi, Nagano-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/80 (2006.01);
U.S. Cl.
CPC ...
Abstract

Test molding is performed by sequentially clamping a moldwith a mold clamping force (100%, 80%, 70%, . . . ) obtained by sequentially lowering a mold clamping force by a predetermined amount from the maximum mold clamping force (100%); with mold position sensorsprovided on outer surfacesandof a fixed platensupporting a fixed moldof the moldand a movable platensupporting a movable moldof the mold, a relative position (mold position Xc) of the movable platenwith respect to the fixed platenin an injection process is detected; and, when at least a variation that meets predetermined conditions is produced on the mold position Xc, a mold clamping force obtained by increasing a mold clamping force at a time of occurrence of the variation by a predetermined amount is set as a proper mold clamping force Fs.


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