The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2011

Filed:

Aug. 23, 2007
Applicants:

Hiroki Fukatsu, Fuji, JP;

Seiji Kayukawa, Fuji, JP;

Hirokazu Ohshiba, Fuji, JP;

Raita Nishikawa, Fuji, JP;

Inventors:

Hiroki Fukatsu, Fuji, JP;

Seiji Kayukawa, Fuji, JP;

Hirokazu Ohshiba, Fuji, JP;

Raita Nishikawa, Fuji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/46 (2006.01); C08L 101/12 (2006.01); C08K 7/00 (2006.01); C09K 19/52 (2006.01); C09K 19/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a material capable of forming a molded product which has good mechanical properties with low warpage while being excellent in any of the performance including heat resistance and flowability, even if the molded product is an asymmetric electronic parts. Specifically, the asymmetric electronic parts is prepared by molding a liquid crystalline polymer composition comprising (A) a fibrous filler having an average fiber diameter within the range of 5 to 30 μm, having a weight average fiber length within the range of 250 to 350 μm, excluding 10 μm or shorter fiber length, and having a content of a fibrous filler being 700 μm or longer within the range of 5% by weight or less; and (B) a plate-like filler having an average particle size within the range of 0.5 to 200 μm, the total filling amount of (A) and (B) components in the composition being within the range of 40 to 60% by weight, the weight ratio of (A) component being within the range of 10 to 20% by weight, the weight ratio of (B) component being within the range of 30 to 40% by weight, the molded product having no symmetry in any of the axial plane XY, the axial plane YZ, and the axial plane XZ of the molded product.


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