The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
May. 08, 2007
Hiroshi Ebihara, Osaka, JP;
Hiroshi Nasu, Osaka, JP;
Katsuhiko Watanabe, Osaka, JP;
Hiroyuki Kobayashi, Osaka, JP;
Hiroshi Ebihara, Osaka, JP;
Hiroshi Nasu, Osaka, JP;
Katsuhiko Watanabe, Osaka, JP;
Hiroyuki Kobayashi, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
An electronic component mounting apparatus includes an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, and the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even when the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.