The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Jan. 14, 2009
Tomoyuki Goi, Tokyo, JP;
Takuya Adachi, Tokyo, JP;
Atsuhi Ajioka, Tokyo, JP;
Hitoshi Hachiga, Tokyo, JP;
Tomoyuki Goi, Tokyo, JP;
Takuya Adachi, Tokyo, JP;
Atsuhi Ajioka, Tokyo, JP;
Hitoshi Hachiga, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The present invention is provided with a high frequency module comprising a multilayered substrate, a power amplifier IC mounted on the upper surface of the multilayered substrate, first and second filters disposed substantially directly below the power amplifier IC in an inner layer of the multilayered substrate, and coupling-reducing ground vias disposed between the first filter and the second filter. At least the first filter is disposed substantially directly below the power amplifier IC. The coupling-reducing ground vias double as thermal vias for dissipating heat generated by the power amplifier IC.