The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Feb. 18, 2009
Noriyuki Nagai, Nara, JP;
Noriyuki Nagai, Nara, JP;
Panasonic Corporation, Osaka, JP;
Abstract
When manufacturing a semiconductor device by mounting a semiconductor chipon a substratewith a flip-chip method, projectionsare formed between padsarranged in multiple annular concentric layers on the semiconductor chipother than padsarranged along the innermost periphery thereof. On the substrate, bonding resinis dispensed onto an area inside the innermost periphery along which the padsare arranged. By heating and applying pressure, the bonding resinis spread over the entire gap between the substrateand the semiconductor chipso as to secure the substrateto the semiconductor chipby the bonding resin, thereby preventing a void from being formed in an area outside the innermost periphery along which the padsare arranged and thus stabilizing an electrical connection state between the semiconductor chipand the substrate