The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
Jan. 28, 2008
Mark G. Clark, Rochester, MN (US);
John R. Dangler, Rochester, MN (US);
Matthew S. Doyle, Rochester, MN (US);
Thomas D. Kidd, Stewartville, MN (US);
Timothy L. Mcmillan, Rochester, MN (US);
Jason T. Stoll, Rochester, MN (US);
Mark G. Clark, Rochester, MN (US);
John R. Dangler, Rochester, MN (US);
Matthew S. Doyle, Rochester, MN (US);
Thomas D. Kidd, Stewartville, MN (US);
Timothy L. McMillan, Rochester, MN (US);
Jason T. Stoll, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.