The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2011
Filed:
May. 06, 2009
Tal Margalith, Pleasanton, CA (US);
Stefano Schiaffino, Pleasanton, CA (US);
Henry Kwong-hin Choy, Sunnyvale, CA (US);
Tal Margalith, Pleasanton, CA (US);
Stefano Schiaffino, Pleasanton, CA (US);
Henry Kwong-Hin Choy, Sunnyvale, CA (US);
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Philps Lumileds Lighting Company, LLC, San Jose, CA (US);
Abstract
Light emitting diode (LED) dies are fabricated by forming LED layers including a first conductivity type layer, a light-emitting layer, and a second conductivity type layer. Trenches are formed in the LED layers that reach at least partially into the first conductivity type layer. Electrically insulation regions are formed in or next to at least portions of the first conductivity type layer along the die edges. A first conductivity bond pad layer is formed to electrically contact the first conductivity type layer and extend over the singulation streets between the LED dies. A second conductivity bond pad layer is formed to electrically contact the second conductivity type layer, and extend over the singulation streets between the LED dies and the electrically insulated portions of the first conductivity type layer. The LED dies are mounted to submounts and the LED dies are singulated along the singulation streets between the LED dies.