The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2011

Filed:

May. 16, 2008
Applicants:

Ahmet Gun Erlat, Clifton Park, NY (US);

Anil Raj Duggal, Niskayuna, NY (US);

Min Yan, Ballston Lake, NY (US);

Inventors:

Ahmet Gun Erlat, Clifton Park, NY (US);

Anil Raj Duggal, Niskayuna, NY (US);

Min Yan, Ballston Lake, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/513 (2006.01); B05D 5/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Processes for simultaneously encapsulating multiple optoelectronic devices and/or depositing a barrier film onto multiple substrates suitable for fabrication of optoelectronic devices thereon include the use of a plasma deposition apparatus having multiple pairs of opposing electrodes for deposition of reactants onto the substrate that is used to form the device or the complete device itself. The processes significantly reduce tact time relative to one at a time batch processing that is currently used for manufacturing optoelectronic devices.


Find Patent Forward Citations

Erlat, Ahmet. (2011). High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices (U.S. Patent No. 7976908). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7976908

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…