The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Apr. 18, 2007
Shoei Kobayashi, Kanagawa, JP;
Susumu Senshu, Kanagawa, JP;
Tamotsu Yamagami, Kanagawa, JP;
Makoto Usui, Osaka, JP;
Hideshi Ishihara, Osaka, JP;
Mitsurou Moriya, Nara, JP;
Cornelis Marinus Schep, Eindhoven, NL;
Jakob Gerrit Nijboer, Geldrop, NL;
Aalbert Stek, Eindhoven, NL;
Shoei Kobayashi, Kanagawa, JP;
Susumu Senshu, Kanagawa, JP;
Tamotsu Yamagami, Kanagawa, JP;
Makoto Usui, Osaka, JP;
Hideshi Ishihara, Osaka, JP;
Mitsurou Moriya, Nara, JP;
Cornelis Marinus Schep, Eindhoven, NL;
Jakob Gerrit Nijboer, Geldrop, NL;
Aalbert Stek, Eindhoven, NL;
Sony Corporation, Tokyo, JP;
Panasonic Corporation, Kadoma-shi, JP;
Koninklijke Philips Electronics, N.V., Eindhoven, NL;
Abstract
An ECC block is constituted by RS(248,216,33). Of a data length of 216 bytes (symbols), only 16 bytes are allocated to BCA data and the remaining 200 bytes are used for fixed data having a predetermined value. Using the fixed data of 200 bytes and the BCA data of 16 bytes, parities of 32 bytes (symbols) are calculated. Only the BCA data of 16 bytes and the parities of the former 16 bytes of the 32-byte parities, that is, a total of 32 bytes only, are recorded in a burst cutting area of an optical disc. In decoding, error correction processing is carried out by using the fixed data of 200 bytes. The unrecorded parities of 16 bytes are processed as having been erased. Thus, the error correction capability in a burst cutting area of an optical disc can be improved.