The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Jan. 27, 2006
Toshiro Izuchi, Osaka, JP;
Kazuo Ono, Osaka, JP;
Kensuke Nakanishi, Osaka, JP;
Hiroaki Onishi, Osaka, JP;
Toshiro Izuchi, Osaka, JP;
Kazuo Ono, Osaka, JP;
Kensuke Nakanishi, Osaka, JP;
Hiroaki Onishi, Osaka, JP;
Hosiden Corporation, Osaka, JP;
Abstract
In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone. However, if it is supposed that the microphone is used near one's mouth, each pore has an area of 0.01 mmor less. In addition, to enhance the dust-proof effect, the pores may be subjected to a water-repellent treatment.