The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Jun. 17, 2009
Applicant:
Yung-chou LI, Taoyuan County, TW;
Inventor:
Yung-Chou Li, Taoyuan County, TW;
Assignees:
Silitek Electronic (Guangzhou) Co., Ltd., Guangzhou, CN;
Lite-On Technology Corp., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat sink for a printed circuit board of power server includes at least one soldering portion. The heat sink is soldered to the printed circuit board at the soldering portion by a lead-free tin soldering process. A plurality of protruding structures protrudes from the soldering portion uniformly. The protruding structures are beneficial for getting a better soldering quality.
Li, Yung-Chou. (2011). Printed circuit board and heat sink (U.S. Patent No. 7974097). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7974097
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile