The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Apr. 18, 2007
Takahide Masuda, Tokyo, JP;
Masashi Sano, Tokyo, JP;
Hiroki Aritomo, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.