The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2011

Filed:

Oct. 31, 2008
Applicant:

Hatsuhide Igarashi, Kanagawa, JP;

Inventor:

Hatsuhide Igarashi, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package includes an insulating substrate configured to be provided for mounting a semiconductor chip which processes a signal with a frequency in a radio frequency band. The insulating substrate includes a first external connecting electrode, a second external connecting electrode, and a partial antenna wiring. The first external connecting electrode and the second external connecting electrode are connected with the partial antenna wiring. Each of the first external connecting electrode and the second external connecting electrode is an electrode to be connected with an external antenna pattern.


Find Patent Forward Citations

Igarashi, Hatsuhide. (2011). Semiconductor package and semiconductor device (U.S. Patent No. 7973719). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7973719

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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