The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Sep. 04, 2007
Li-cheng Shen, Hsinchu, TW;
Li-Cheng Shen, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An embedded chip package includes a substrate, a semiconductor structure, an encapsulating material layer and a plurality of conductive vias. Herein the substrate includes at least a dielectric layer and at least a patterned circuit layer disposed on the dielectric layer. The semiconductor structure is disposed on the substrate and has a plurality of electrical bonding pads, and the electrical bonding pads contact the dielectric layer. The encapsulating material layer is disposed on the substrate and around the semiconductor structure. In addition, a plurality of conductive vias is disposed in the substrate to electrically connect the patterned circuit layer to the electrical bonding pads.