The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Feb. 20, 2004
Yasuyuki Arai, Atsugi, JP;
Akira Ishikawa, Atsugi, JP;
Toru Takayama, Atsugi, JP;
Junya Maruyama, Ebina, JP;
Yuugo Goto, Atsugi, JP;
Yumiko Ohno, Atsugi, JP;
Yuko Tachimura, Atsugi, JP;
Yasuyuki Arai, Atsugi, JP;
Akira Ishikawa, Atsugi, JP;
Toru Takayama, Atsugi, JP;
Junya Maruyama, Ebina, JP;
Yuugo Goto, Atsugi, JP;
Yumiko Ohno, Atsugi, JP;
Yuko Tachimura, Atsugi, JP;
Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;
Abstract
The present invention provides an ultrathin thin film integrated circuit and a thin film integrated circuit device including the thin film integrated circuit device. Accordingly, the design of a product is not spoilt while an integrated circuit formed from a silicon wafer, which is thick and produces irregularities on the surface of the product container. The thin film integrated circuit according to the present invention includes a semiconductor film as an active region (for example a channel region in a thin film transistor), unlike an integrated circuit formed from a conventional silicon wafer. The thin film integrated circuit according to the present invention is thin enough that the design is not spoilt even when a product such as a card or a container is equipped with the thin film integrated circuit.