The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Jun. 20, 2008
Heewon Jeong, Tokyo, JP;
Yasushi Goto, Kokubunji, JP;
Yuko Hanaoka, Kodaira, JP;
Tsukasa Fujimori, Kokubunji, JP;
Heewon Jeong, Tokyo, JP;
Yasushi Goto, Kokubunji, JP;
Yuko Hanaoka, Kodaira, JP;
Tsukasa Fujimori, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Provided is a MEMS device which is robust to the misalignment and does not require the double-side wafer processing in the manufacture of a MEMS device such as an angular velocity sensor, an acceleration sensor, a combined sensor or a micromirror. After preparing a substrate having a space therein, holes are formed in a device layer at positions where fixed components such as a fixing portion, a terminal portion and a base that are fixed to a supporting substrate are to be formed, and the holes are filled with a fixing material so that the fixing material reaches the supporting substrate, thereby fixing the device layer around the holes to the supporting substrate.