The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2011

Filed:

Jun. 10, 2008
Applicants:

Mitsutoshi Hasegawa, Yokohama, JP;

Kazuo Koyanagi, Atsugi, JP;

Masahiro Tagawa, Isehara, JP;

Nobuhiro Ito, Yamato, JP;

Yasuo Ohashi, Naka-gun, JP;

Shigeto Kamata, Yokohama, JP;

Inventors:

Mitsutoshi Hasegawa, Yokohama, JP;

Kazuo Koyanagi, Atsugi, JP;

Masahiro Tagawa, Isehara, JP;

Nobuhiro Ito, Yamato, JP;

Yasuo Ohashi, Naka-gun, JP;

Shigeto Kamata, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of a hermetically sealed container, comprises steps of placing, on a first member, a first bonding material and a second bonding material having a larger compressibility in relation to a pressing force than a compressibility of the first bonding material, such that the first and second bonding materials are arranged side-to-side relationship, and the first bonding material has a height lower than a height of the second bonding material; pressing a second member to the second bonding material; heating and melting sequentially part by part the first bonding material; and cooling the first bonding material to bond together the first and second members.


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