The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Jun. 19, 2008
Shuhichi Okabe, Gyunggi-do, KR;
Jin-yong an, Daejeon, KR;
Seok-kyu Lee, Suwon-si, KR;
Soon-oh Jung, Suwon-si, KR;
Jong-kuk Hong, Suwon-si, KR;
Hae-nam Seo, Seoul, KR;
Shuhichi Okabe, Gyunggi-do, KR;
Jin-Yong An, Daejeon, KR;
Seok-Kyu Lee, Suwon-si, KR;
Soon-Oh Jung, Suwon-si, KR;
Jong-Kuk Hong, Suwon-si, KR;
Hae-Nam Seo, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.