The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Mar. 09, 2009
Yoshimi Takahashi, Beppu, JP;
Masazumi Amagai, Tsukuba, JP;
Yoshimi Takahashi, Beppu, JP;
Masazumi Amagai, Tsukuba, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elementsare arranged on the surface of substrate; a process step in which the inner side of substrateis fixed on lower die; a process step in which liquid resinis supplied from nozzleonto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips; a process step in which the upper die having plural cavitiesformed in one surface is pressed onto the lower die, and liquid resinis molded at a prescribed temperature by means of plural cavities; and a process step in which cavitiesof upper dieare detached from the substrate, and plural molding resin portions are formed individually.