The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Mar. 26, 2009
Applicants:
Masaaki Tanaka, Kariya, JP;
Kimiharu Kayukawa, Nisshin, JP;
Inventors:
Masaaki Tanaka, Kariya, JP;
Kimiharu Kayukawa, Nisshin, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness greater than a hardness of each of the first and second bumps. The first and second members are positioned with respect to each other such that the first and second bumps face each other. The tip portion of the first bump is brought into contact with a tip portion of the second bump by sticking the projection into the tip portion of the second bump.