The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Jan. 03, 2007
Mehmet Arik, Niskayuna, NY (US);
Chellappa Balan, Niskayuna, NY (US);
Todd Garrett Wetzel, Niskayuna, NY (US);
Stephen Adam Solovitz, Portland, OR (US);
Charles Max Byrd, White Plains, NY (US);
Stanton Earl Weaver, Jr., Northville, NY (US);
Mehmet Arik, Niskayuna, NY (US);
Chellappa Balan, Niskayuna, NY (US);
Todd Garrett Wetzel, Niskayuna, NY (US);
Stephen Adam Solovitz, Portland, OR (US);
Charles Max Byrd, White Plains, NY (US);
Stanton Earl Weaver, Jr., Northville, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.