The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Apr. 14, 2008
Hisahiko Yoshida, Osaka, JP;
Hisahiko Yoshida, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device mounting structure includes a semiconductor device whose electrodes are aligned on its one main face; a circuit board having board electrodes electrically connected to the electrodes of the semiconductor device by solder bumps; and curable resin applied between at least the side face of the semiconductor device and the circuit board. Multiple types of thermally expandable particles with different expansion temperatures are mixed in this curable resin. This structure offers the semiconductor device mounting structure that is highly resistant to impact and suited for mass production, its manufacturing method, and a removal method of the semiconductor device. In addition, this structure facilitates repair and reworking, leaving almost no adhesive residue on the circuit board after repair. Stress applied to the circuit board during repair can also be minimized.