The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2011

Filed:

Oct. 29, 2008
Applicants:

Ahmad Ashrafzadeh, Morgan Hill, CA (US);

Mansour Izadinia, Cupertino, CA (US);

Nitin Kalje, Cupertino, CA (US);

Ignacio Mcquirk, Los Altos, CA (US);

Inventors:

Ahmad Ashrafzadeh, Morgan Hill, CA (US);

Mansour Izadinia, Cupertino, CA (US);

Nitin Kalje, Cupertino, CA (US);

Ignacio McQuirk, Los Altos, CA (US);

Assignee:

Maxim Integrated Products, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one side to the other side of the lead frame, thereby forming coil segments. After mounting the integrated circuit and wire bonding its connections, the lead frame is placed on a ferrite plate, the assembly is encapsulated in resin, and the leads trimmed and bent. Mounting of the packaged integrated circuit on a properly prepared printed circuit interconnects the coil segments in the package to coil segments on the printed circuit, thereby forming a single, multi-turn coil around the ferrite plate. Various embodiments are disclosed.


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