The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Mar. 01, 2007
Thomas Nuebel, Warstein, DE;
Oliver Schilling, Warstein, DE;
Reinhold Spanke, Bestwig, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The power semiconductor module () has a heat-conducting base plate () on which at least three substrates () are placed, each substrate supporting at least one power semiconductor component () that gives off heat generated during operation. In order to optimize a power semiconductor module of this type with regard to mechanical load and heat dissipation, the substrates () are placed on the base plate () while being arranged in a single row (), and pressing devices (), which are situated close to the substrate, are provided on both longitudinal sides () of the base plate () while being arranged parallel to the row (). The base plate can be pressed against a cooling surface by the pressing devices.