The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2011

Filed:

Mar. 01, 2007
Applicants:

Masato Ono, Sagamihara, JP;

Hideyuki Kanno, Kawaguchi, JP;

Koki Matsumoto, Komatsushima, JP;

Inventors:

Masato Ono, Sagamihara, JP;

Hideyuki Kanno, Kawaguchi, JP;

Koki Matsumoto, Komatsushima, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2010.01); H01L 23/495 (2010.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprises a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate, and a sealing member covering a semiconductor element arranged on the support member, wherein the support member has an insulating portion where the insulating substrate is exposed between the pair of the first conductive materials, and at least one of the pair of the second conductive materials is arranged along the side of the insulating portion, and the sealing member is disposed so that the sealing member is over at least a part of at least one of the first conductive materials and the second conductive materials.


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