The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Aug. 27, 2009
Young Sam Park, Seoul, KR;
Seung Ick Lee, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Hyung Suk Kim, Kyungki-do, KR;
Bum Jin Kim, Kyungki-do, KR;
Young June Jeong, Kyungki-do, KR;
Ho Sik Ahn, Kyungki-do, KR;
Jung Kyu Park, Seoul, KR;
Young Sam Park, Seoul, KR;
Seung Ick Lee, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Hyung Suk Kim, Kyungki-do, KR;
Bum Jin Kim, Kyungki-do, KR;
Young June Jeong, Kyungki-do, KR;
Ho Sik Ahn, Kyungki-do, KR;
Jung Kyu Park, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-do, KR;
Abstract
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.