The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Jul. 07, 2006
Applicant:
Hideki Higashitani, Osaka, JP;
Inventor:
Hideki Higashitani, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring substrate of the invention comprises an electrical insulation substrate (), a through-hole () formed in the electrical insulation substrate, electrically conductive paste () filled inside the through-hole, and wiring traces () formed on one or both surfaces of the electrical insulation substrate and electrically connected with the electrically conductive paste, wherein interfaces of the wiring traces in contact with the electrically conductive paste have at least one of an asperate surface and a smooth surface, and a plurality of granular bumps () formed further thereon.